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Datacon 2200 evo price3/31/2024 ![]() ![]() ![]() ![]() To provide even more flexibility, an adhesive tape feeder & cutter can be integrated at the additional dispense axis, offering the parallel processing of film application and die placement in one module. For very high production volumes, several Multi-chip die bonders can be linked up to work in parallel. The tried-and-tested, modular concept has also been retained in the multi-chip die bonder. This significantly increases not only the throughput but also in particular the yield. This enables production, for instance of SiPs (System in a Package), with all kinds of active and passive components in a single pass. Further features include the heatable bonding tool, for example for stacked-die applications, and the broad handling range from 250 µm small up to 50 mm large dies. Of course the multi-chip die bonder is not just intended for die attach, but is also a fully-fledged flip-chip bonder. ![]()
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